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Inventor profile of:

Wenbo Tian

City:

Country:

United States

Published Applications:

1

Last publication date:

2012-03-29

Recent patent applications by Tian Wenbo

Wenbo Tian from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2012-03-29

US20120074505A1

3D Integrated circuit in planar process

InventorID:

3129675 ⎘