Paul Bantz

City:

Los Altos, California

Country:

United States

Published Applications:

Last publication date:

2012-04-05

Top Assignees for applications by Paul Bantz

The entities that hold a legal rights for patent applications filed by inventor Bantz Paul:

Paul Bantz from Los Altos, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Sheet-molded chip-scale package

InventorID:

3134860 ⎘