Yee Kim LEE

City:

Segamat

Country:

Malaysia

Published Applications:

Last publication date:

2012-04-05

Top Assignees for applications by Yee Kim LEE

The entities that hold a legal rights for patent applications filed by inventor LEE Yee Kim:

Yee Kim LEE from Segamat, MY has applied for patents for these inventions. The list has both pending applications and granted patents:

Delamination resistant device package having raised bond surface and mold locking aperture

Delamination resistant device package having low moisture sensitivity

DAP GROUND BOND ENHANCEMENT

InventorID:

3134875 ⎘