Byron, Minnesota
United States
18
2012-04-26
The entities that hold a legal rights for patent applications filed by inventor Colbert John Lee:
John Lee Colbert from Byron, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Multi-chip module system with removable socketed modules
#2 | 2010-04-01Dual swivel in-line load node lock mechanism
#3 | 2008-11-20Electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member
#4 | 2008-10-30Mounting a heat sink in thermal contact with an electronic component
#5 | 2008-10-23Mounting a heat sink in thermal contact with an electronic component
#6 | 2008-09-25Customizable backer for achieving consistent loading and engagement of array package connections
#7 | 2008-02-21High performance reworkable heatsink and packaging structure with solder release layer and method of making
#8 | 2008-01-10Customizable backer for achieving consistent loading and engagement of array package connections
#9 | 2007-10-25Non-influencing fastener for mounting a heat sink in contact with an electronic component
#10 | 2007-10-18Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof
#11 | 2007-10-04Method and Apparatus for Electrically Connecting Two Substrates Using a Resilient Wire Bundle Captured in an Aperture of an Interposer by a Retention Member
#12 | 2007-10-04Method and Apparatus for Electrically Connecting Two Substrates Using a Resilient Wire Bundle Captured in an Aperture of an Interposer by a Retention Member
#13 | 2007-06-28High performance reworkable heatsink and packaging structure with solder release layer
#14 | 2007-06-14Method and apparatus for electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member
#15 | 2007-02-15Mounting a heat sink in thermal contact with an electronic component
#16 | 2006-06-15Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof
#17 | 2005-12-15Method and apparatus for managing aligning and coupling of a land grid array interposer for a field replacement unit
#18 | 2005-01-13Method and apparatus for mounting a heat transfer apparatus upon an electronic component
3149582 ⎘