Mark Kenneth Hoffmeyer

Multi-chip module system with removable socketed modules

Implementing enhanced solder joint robustness for SMT pad structure

Plastic land grid array (PLGA) module with inverted hybrid land grid array (LGA) interposer

Plastic land grid array (PLGA) module and printed wiring board (PWB) with enhanced contact metallurgy construction

Surface Mount Technology Pad Layout for Docking Connector Systems

Mounting a heat sink in thermal contact with an electronic component

Mounting a heat sink in thermal contact with an electronic component

Apparatus for electrically connecting two substrates using a land grid array connector provided with a frame structure having power distribution elements

Customizable backer for achieving consistent loading and engagement of array package connections

High performance reworkable heatsink and packaging structure with solder release layer and method of making

Customizable backer for achieving consistent loading and engagement of array package connections

Via resistor structure and method for trimming resistance value

High performance reworkable heatsink and packaging structure with solder release layer

Mounting a heat sink in thermal contact with an electronic component

Method and structure for implementing enhanced interconnection performance of a land grid array (LGA) module and a printed wiring board

Method and structures for implementing customizable dielectric printed circuit card traces

Sash for land grid arrays

Method and structures for implementing customizable dielectric printed circuit card traces

Structure for repairing or modifying surface connections on circuit boards

Method and structure for repairing or modifying surface connections on circuit boards