Brewster, New York
United States
46
2020-11-26
The entities that hold a legal rights for patent applications filed by inventor Takken Todd E.:
Todd E. Takken from Brewster, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Multi-device cooling structure having assembly alignment features
#2 | 2020-11-12Broadside coupled coplanar inductors
#3 | 2020-11-05Smart controller with phantom inductor current sensing for switched mode power supplies
#4 | 2020-10-29Injection-molded flexible cold plate
#5 | 2020-10-22Cold plate with flex regions between fin areas
#6 | 2020-09-17Ultra low parasitic inductance integrated cascode GaN devices
#7 | 2020-07-09Mechanically flexible cold plates for low power components
#8 | 2020-04-09Fully integrated multi-phase buck converter with coupled air core inductors
#9 | 2020-02-20High switching frequency, low loss and small form factor fully integrated power stage
#10 | 2020-01-30Space-efficient pressure relief mechanism for immersion cooling of computing elements
#11 | 2019-12-10Fully integrated multi-phase buck converter with coupled air core inductors
#12 | 2019-11-21Peripheral end face attachment of exposed copper layers of a first printed circuit board to the surface of a second printed circuit board by surface mount assembly
#13 | 2019-08-08High switching frequency, low loss and small form factor fully integrated power stage
#14 | 2019-07-04Injection-molded flexible cold plate
#15 | 2019-06-27Mechanically flexible cold plates for low power components
#16 | 2019-06-27Space-efficient pressure relief mechanism for immersion cooling of computing elements
#17 | 2019-06-27Interdigitated power connector
#18 | 2019-05-30Voltage control utilizing multiple PWM patterns
#19 | 2019-05-30Electrical contacts on the sidewall of a circuit board
#20 | 2019-05-23Burst resistant thin wall heat sink
#21 | 2019-05-09Peripheral end face attachment of exposed copper layers of a first printed circuit board to the surface of a second printed circuit board by surface mount assembly
#22 | 2019-05-09Solder assembly of pins to the peripheral end face of a printed circuit board
#23 | 2019-01-22Coupled-inductor DC-DC power converter
#24 | 2019-01-17High-density, fail-in-place switches for computer and data networks
#25 | 2018-10-09Voltage control utilizing multiple PWM patterns
#26 | 2017-07-06Power converter using near-load output capacitance, direct inductor contact, and/or remote current sense
#27 | 2017-06-15Near-chip compliant layer for reducing perimeter stress during assembly process
#28 | 2017-06-01High-density, fail-in-place switches for computer and data networks
#29 | 2017-04-27Distributed serialized data buffer and a memory module for a cascadable and extended memory subsystem
#30 | 2017-03-16Nonvolatile memory interface for metadata shadowing
#31 | 2017-02-14Near-chip compliant layer for reducing perimeter stress during assembly process
#32 | 2017-01-19Nonvolatile memory interface for metadata shadowing
#33 | 2016-10-06Nonvolatile memory interface for metadata shadowing
#34 | 2016-10-06Nonvolatile memory interface for metadata shadowing
#35 | 2016-10-06Flexible cold plate with enhanced flexibility
#36 | 2016-10-06Burst resistant thin wall heat sink
#37 | 2016-04-14Collective network for computer structures
#38 | 2015-10-08High-density, fail-in-place switches for computer and data networks
#39 | 2015-08-20Implementing inverted master-slave 3D semiconductor stack
#40 | 2015-08-20Implementing inverted master-slave 3D semiconductor stack
#41 | 2014-04-24Memory system connector
#42 | 2013-06-27Low latency and persistent data storage
#43 | 2011-09-08Collective network for computer structures
#44 | 2008-08-26Data capture technique for high speed signaling
#45 | 2008-05-01Collective network for computer structures
#46 | 2005-04-21Dielectric structure for printed circuit board traces
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