Benjamin Michael Meyer

City:

Definance, Missouri

Country:

United States

Published Applications:

Last publication date:

2013-07-04

Top Assignees for applications by Benjamin Michael Meyer

The entities that hold a legal rights for patent applications filed by inventor Meyer Benjamin Michael:

MEMC Singapore Pte. Ltd. (UEN200614794D) 1 Singapore, Singapore
MEMC SINGAPORE, PTE. LTD (UEN200614797D) 1 Singapore, Singapore

Recent patent applications by Meyer Benjamin Michael

Benjamin Michael Meyer from Definance, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-07-04

US20130167591A1

Mechanical engineering

Methods of adjusting insulation in a directional solidification furnace

InventorID:

317393 ⎘