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Inventor profile of:

Hideki Higashitani

City:

Mie

Country:

Japan

Published Applications:

1

Last publication date:

2013-07-04

Recent patent applications by Higashitani Hideki

Hideki Higashitani from Mie, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-07-04

US20130168148A1

MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING SAME

InventorID:

318361 ⎘