Wolnzach
Germany
5
2021-12-02
The entities that hold a legal rights for patent applications filed by inventor Reitlinger Claus:
Claus Reitlinger from Wolnzach, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Package comprising a substrate, an integrated device, and an encapsulation layer with undercut
#2 | 2019-05-30Stacked modules
#3 | 2013-12-26ELECTRICAL MODULE FOR BEING RECEIVED BY AUTOMATIC PLACEMENT MACHINES BY MEANS OF GENERATING A VACUUM
#4 | 2013-07-04Method for producing a plurality of electronic devices
#5 | 2013-07-04Module package and production method
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