Andrew Jonathan Brindle

City:

Clay, New York

Country:

United States

Published Applications:

Last publication date:

2012-07-05

Top Assignees for applications by Andrew Jonathan Brindle

The entities that hold a legal rights for patent applications filed by inventor Brindle Andrew Jonathan:

SRC, INC. 2 North Syracuse, NY United States

Recent patent applications by Brindle Andrew Jonathan

Andrew Jonathan Brindle from Clay, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2012-07-05

US20120170224A1

Electricity

CIRCUIT BOARD FRAME WITH INTEGRAL HEAT SINK FOR ENHANCED THERMAL TRANSFER

#2 | 2012-06-28

US20120160449A1

Electricity

Thermal transfer component, apparatus and method including thermally conductive frame penetrated by thermally conductive plug

InventorID:

3200447 ⎘