Yoon Su KIM

City:

Gangwon-do

Country:

South Korea

Published Applications:

Last publication date:

2012-06-28

Top Assignees for applications by Yoon Su KIM

The entities that hold a legal rights for patent applications filed by inventor KIM Yoon Su:

Yoon Su KIM from Gangwon-do, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

SUBSTRATE FOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Method for fabricating semiconductor package substrate having different thicknesses between wire bonding pad and ball pad

Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same

InventorID:

3201073 ⎘