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Inventor profile of:

Daisuke Watanabe

City:

Niza-shi

Country:

Japan

Published Applications:

1

Last publication date:

2012-06-28

Recent patent applications by Watanabe Daisuke

Daisuke Watanabe from Niza-shi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2012-06-28

US20120164387A1

Performing operations; transporting

Molding Die, Optical Element, and Method of Preparing Molding Die

InventorID:

3203075 ⎘