Tokyo
Japan
6
2012-08-16
The entities that hold a legal rights for patent applications filed by inventor Ikeda Koichi:
Koichi Ikeda from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Hydrogenated norbornene-based ring-opening polymerization polymer, resin composition, and molded object
#2 | 2012-07-05Hydrogenated norbornene-based ring-opening polymerization polymer, resin composition, and molded object
#3 | 2012-06-28Hydrogenated norbornene-based ring-opening polymerization polymer, resin composition, and molded object
#4 | 2012-06-28Hydrogenated norbornene-based ring-opening polymerization polymer, resin composition, and molded object
#5 | 2010-03-25HYDROGENATED NORBORNENE-BASED RING-OPENING POLYMERIZATION POLYMER, RESIN COMPOSITION, AND MOLDED OBJECT
#6 | 2009-11-10Method for manufacturing multilayer circuit board and resin base material
3203143 ⎘