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Inventor profile of:

Eung-Suek Lee

City:

Ansan-si

Country:

South Korea

Published Applications:

Last publication date:

2012-07-05

Top Assignees for applications by Eung-Suek Lee

The entities that hold a legal rights for patent applications filed by inventor Lee Eung-Suek:

SAMSUNG ELECTRO-MECHANICS CO., LTD. 10 Suwon, South Korea
SAMSUNG ELECTRO-MECHANICS CO., LTD. 5 Suwon-si, South Korea
SUNGKYUNKWAN UNIVERSITY FOUNDATION FOR CORPORATE COLLABORATION 1 Suwon-si, South Korea
SAMSUNG ELECTRO-MECHANICS CO., LTD. 1 Gyunggi-do, South Korea
Samsung Electro-Mechanics Co. 1 Suwon-Si, South Korea
Samsung Electro-Mechanics Co., Ltd 1 , South Korea

Recent patent applications by Lee Eung-Suek

Eung-Suek Lee from Ansan-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2012-07-05

US20120168205A1

Performing operations; transporting

METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD

#2 | 2010-11-18

US20100288726A1

Electricity

Method for manufacturing printed circuit board

#3 | 2009-12-31

US20090321109A1

Performing operations; transporting

Method of manufacturing a printed circuit board

#4 | 2009-12-03

US20090294739A1

Electricity

CONDUCTIVE PASTE INCLUDING A CARBON NANOTUBE AND PRINTED CIRCUIT BOARD USING THE SAME

#5 | 2009-09-17

US20090229875A1

Electricity

Printed circuit board having fine pattern and manufacturing method thereof

#6 | 2009-06-25

US20090159318A1

Electricity

Printed circuit board and manufacturing method thereof

#7 | 2009-05-07

US20090114425A1

Electricity

CONDUCTIVE PASTE AND PRINTED CIRCUIT BOARD USING THE SAME

#8 | 2009-04-30

US20090107709A1

Electricity

Printed circuit board and manufacturing method thereof

#9 | 2009-04-02

US20090083975A1

Electricity

Method of interconnecting layers of a printed circuit board

#10 | 2009-03-12

US20090064497A1

Electricity

Printed circuit board using paste bump and manufacturing method thereof

#11 | 2009-01-15

US20090017275A1

Electricity

Heat-releasing printed circuit board and manufacturing method thereof

#12 | 2008-11-20

US20080283288A1

Electricity

Printed circuit board using paste bump and manufacturing method thereof

#13 | 2008-05-29

US20080121414A1

Electricity

Printed circuit board and method for manufacturing thereof

#14 | 2008-03-06

US20080052902A1

Electricity

Method of manufacturing a circuit board

#15 | 2008-01-10

US20080009146A1

Electricity

Printed circuit board and manufacturing method thereof

#16 | 2007-05-17

US20070107934A1

Electricity

Printed circuit board using paste bump and manufacturing method thereof

#17 | 2007-03-15

US20070059917A1

Electricity

Printed circuit board having fine pattern and manufacturing method thereof

InventorID:

3206235 ⎘