Inventor profile of:

Vidhya Ramachandran

City:

Ossining, New York

Country:

United States

Published Applications:

19

Last publication date:

2012-07-05

Top Assignees for applications by Vidhya Ramachandran

The entities that hold a legal rights for patent applications filed by inventor Ramachandran Vidhya:

Recent patent applications by Ramachandran Vidhya

Vidhya Ramachandran from Ossining, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2012-07-05
US20120168210A1
Electricity

Methods and Structures Involving Terminal Connections

#2 | 2009-04-30
US20090111235A1
Electricity

Semiconductor integrated circuit devices having high-Q wafer back-side capacitors

#3 | 2009-02-12
US20090039522A1
Electricity

Bipolar and CMOS integration with reduced contact height

#4 | 2008-08-21
US20080197495A1
Electricity

STRUCTURE FOR REDUCING LATERAL FRINGE CAPACITANCE IN SEMICONDUCTOR DEVICES

#5 | 2008-01-24
US20080020488A1
Electricity

Semiconductor integrated circuit devices having high-Q wafer backside inductors and methods of fabricating same

#6 | 2008-01-24
US20080019077A1
Electricity

Formation of metal-insulator-metal capacitor simultaneously with aluminum metal wiring level using a hardmask

#7 | 2007-12-20
US20070290359A1
Electricity

Inexpensive method of fabricating a higher performance capacitance density MIMcap integrable into a copper interconnect scheme

#8 | 2007-12-06
US20070278619A1
Electricity

Semiconductor integrated circuit devices having high-Q wafer back-side capacitors

#9 | 2007-11-29
US20070275552A1
Electricity

Method of forming a structure for reducing lateral fringe capacitance in semiconductor devices

#10 | 2007-09-20
US20070218625A1
Electricity

Trench metal-insulator-metal (MIM) capacitors integrated with middle-of-line metal contacts, and method of fabricating same

#11 | 2007-03-22
US20070063244A1
Electricity

Trench metal-insulator-metal (MIM) capacitors and method of fabricating same

#12 | 2007-03-15
US20070057302A1
Electricity

Trench metal-insulator-metal (MIM) capacitors integrated with middle-of-line metal contacts, and method of fabricating same

#13 | 2007-03-01
US20070046421A1
Electricity

STRUCTURE AND METHOD FOR FORMING THIN FILM RESISTOR WITH TOPOGRAPHY CONTROLLED RESISTANCE DENSITY

#14 | 2006-08-24
US20060189069A1
Electricity

Structure and method for integrating MIM capacitor in BEOL wiring levels

#15 | 2006-02-09
US20060027878A1
Electricity

FEOL/MEOL metal resistor for high end CMOS

#16 | 2005-12-15
US20050274987A1
Electricity

Inexpensive method of fabricating a higher performance capacitance density MIMcap integrable into a copper interconnect scheme

#17 | 2005-12-08
US20050272219A1
Electricity

Formation of metal-insulator-metal capacitor simultaneously with aluminum metal wiring level using a hardmask

#18 | 2005-07-21
US20050156278A1
Electricity

Metal-insulator-metal capacitor and method of fabrication

#19 | 2005-03-31
US20050067701A1
Electricity

Metal-insulator-metal capacitor and method of fabrication

InventorID:

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