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Inventor profile of:

Daisuke Sakurai

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2026-04-30

Top Assignees for applications by Daisuke Sakurai

The entities that hold a legal rights for patent applications filed by inventor Sakurai Daisuke:

PANASONIC CORPORATION 17 Osaka, Japan
Panasonic Intellectual Property Management Co., Ltd. 10 Osaka, Japan
KUBOTA CORPORATION 3 Osaka, Japan
PANASONIC CORPORATION 3 Kadoma-shi, Osaka, Japan
PANASONIC CORPORATION 1 Kadoma-shi, Japan
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 1 Osaka, Japan
Panasonic Corparation 1 Osaka, Japan

Recent patent applications by Sakurai Daisuke

Daisuke Sakurai from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-04-30

US20260122788A1

Electricity

HYBRID MOLD, METHOD FOR MANUFACTURING HYBRID MOLD, WIRING STRUCTURE, AND METHOD FOR MANUFACTURING WIRING STRUCTURE

#2 | 2026-03-26

US20260086285A1

Physics

PHOTONIC INTERCONNECT AND METHOD FOR MANUFACTURING SAME

#3 | 2025-12-25

US20250389907A1

Physics

METHOD FOR PRODUCING OPTICAL MODULE, AND OPTICAL MODULE

#4 | 2025-09-11

US20250286005A1

Electricity

SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD FOR SAME

#5 | 2024-11-21

US20240387444A1

Electricity

FLIP-CHIP MOUNTING STRUCTURE AND FLIP-CHIP MOUNTING METHOD

#6 | 2024-10-03

US20240332234A1

Electricity

BUMP MANUFACTURING METHOD AND IMPRINT DIE USED IN SAME

#7 | 2023-03-23

US20230089483A1

Electricity

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

#8 | 2021-11-25

US20210366817A1

Electricity

Semiconductor device and methods of manufacturing semiconductor device

#9 | 2021-09-30

US20210305293A1

Electricity

Solid-state imaging apparatus including semiconductor element with photoelectric converter and strain sensors

#10 | 2020-11-19

US20200362884A1

Mechanical engineering

Hydraulic system for working machine

#11 | 2020-06-18

US20200195867A1

Electricity

Solid-state imaging device having electronic components mounted between a main substrate and an imaging element

#12 | 2019-06-13

US20190181110A1

Electricity

Method for manufacturing semiconductor device

#13 | 2019-05-09

US20190137708A1

Physics

Optical module structure

#14 | 2018-06-28

US20180180068A1

Mechanical engineering

Hydraulic system for working machine

#15 | 2018-06-14

US20180163375A1

Fixed constructions

Hydraulic system for working machine

#16 | 2014-10-09

US20140299986A1

Electricity

Semiconductor device manufacturing method and semiconductor device

#17 | 2014-08-07

US20140217595A1

Electricity

Mounting structure and manufacturing method for same

#18 | 2014-01-09

US20140010991A1

Performing operations; transporting

Solder transfer substrate, manufacturing method of solder transfer substrate, and solder transfer method

#19 | 2013-11-21

US20130307146A1

Electricity

Mounting structure of electronic component with joining portions and method of manufacturing the same

#20 | 2013-07-18

US20130181041A1

Performing operations; transporting

Manufacturing method of solder transfer substrate, solder precoating method, and solder transfer substrate

#21 | 2013-07-04

US20130170165A1

Electricity

Electronic-component mounted body, electronic component, and circuit board

#22 | 2012-07-05

US20120168961A1

Electricity

Semiconductor device

#23 | 2012-05-24

US20120125676A1

Electricity

Three-dimensional circuit board

#24 | 2011-09-29

US20110233767A1

Electricity

Semiconductor device and semiconductor device manufacturing method

#25 | 2010-06-17

US20100148362A1

Electricity

Semiconductor device and method for fabricating the same

#26 | 2010-03-04

US20100052189A1

Electricity

Electronic component mounting structure and method for manufacturing the same

#27 | 2010-02-04

US20100029044A1

Electricity

Conductive bump, method for manufacturing the conductive bump, semiconductor device and method for manufacturing the semiconductor device

#28 | 2009-12-24

US20090315178A1

Electricity

Conductive bump, method for producing the same, and electronic component mounted structure

#29 | 2009-10-29

US20090268423A1

Electricity

Interconnect substrate and electronic circuit mounted structure

#30 | 2009-10-29

US20090266582A1

Electricity

Three-dimensional circuit board and its manufacturing method

#31 | 2009-10-01

US20090246474A1

Electricity

ELECTRONIC COMPONENT MOUNTED STRUCTURE AND METHOD OF MANUFACTURING THE SAME

#32 | 2009-07-09

US20090173795A1

Electricity

Card type information device and method for manufacturing same

#33 | 2009-02-12

US20090039168A1

Physics

Noncontact information storage medium and method for manufacturing same

#34 | 2009-01-29

US20090026634A1

Electricity

Method of manufacturing an electronic part mounting structure

#35 | 2008-04-24

US20080094793A1

Electricity

Electronic circuit device, electronic device using the same, and method for manufacturing the same

#36 | 2006-01-19

US20060014403A1

Electricity

Connecting structure of circuit board and method for manufacturing the same

InventorID:

321639 ⎘