Inventor profile of:

Peter Deane

City:

Los Altos, California

Country:

United States

Published Applications:

17

Last publication date:

2012-07-19

Top Assignees for applications by Peter Deane

The entities that hold a legal rights for patent applications filed by inventor Deane Peter:

Recent patent applications by Deane Peter

Peter Deane from Los Altos, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2012-07-19
US20120182659A1
Electricity

Dual-directional electrostatic discharge protection method

#2 | 2011-05-03
US11890167
-

Dual-directional electrostatic discharge protection device

#3 | 2008-02-05
US10873031
-

Operation of dual-directional electrostatic discharge protection device

#4 | 2007-03-29
US20070071391A1
Physics

Optical sub-assembly packaging techniques that incorporate optical lenses

#5 | 2006-05-30
US10304356
-

Method of compensating for temperature changes and channel variations in a laser diode array to produce a substantially constant average optical power over temperature

#6 | 2006-02-21
US9957936
-

Technique for protecting photonic devices in optoelectronic packages with clear overmolding

#7 | 2006-01-05
US20060001183A1
Performing operations; transporting

Technique for protecting photonic devices in optoelectronic packages with clear overmolding

#8 | 2005-12-06
US10165548
-

Techniques for attaching rotated photonic devices to an optical sub-assembly in an optoelectronic package

#9 | 2005-08-11
US20050175297A1
Physics

Optical sub-assembly for opto-electronic modules

#10 | 2005-07-21
US20050157990A1
Physics

Optical sub-assembly packaging techniques that incorporate optical lenses

#11 | 2005-07-12
US10165553
-

Optical sub-assembly for optoelectronic modules

#12 | 2005-06-02
US20050117835A1
Physics

Techniques for joining an opto-electronic module to a semiconductor package

#13 | 2005-05-12
US20050100294A1
Physics

Techniques for joining an opto-electronic module to a semiconductor package

#14 | 2005-03-08
US10317841
-

Optical sub-assembly packaging techniques that incorporate optical lenses

#15 | 2005-02-22
US10412564
-

Techniques for joining an opto-electronic module to a semiconductor package

#16 | 2005-01-18
US10392802
-

Multi-format connector module incorporating chip mounted optical sub-assembly

#17 | 2005-01-04
US10652805
-

Techniques for joining an opto-electronic module to a semiconductor package

InventorID:

3217647 ⎘