Essex Junction, Vermont
United States
33
2012-08-23
The entities that hold a legal rights for patent applications filed by inventor ESHUN Ebenezer E.:
Ebenezer E. ESHUN from Essex Junction, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Method of making heat sink for integrated circuit devices
#2 | 2012-07-19Process for single and multiple level metal-insulator-metal integration with a single mask
#3 | 2009-03-12Integrated BEOL thin film resistor
#4 | 2009-01-15High tolerance TCR balanced high current resistor for RF CMOS and RF SiGe BiCMOS applications and cadenced based hierarchical parameterized cell design kit with tunable TCR and ESD resistor ballasting feature
#5 | 2008-12-25Junction field effect transistor with a hyperabrupt junction
#6 | 2008-07-24INTEGRATED CIRCUIT (IC) CHIP WITH ONE OR MORE VERTICAL PLATE CAPACITORS AND METHOD OF MAKING THE CAPACITORS
#7 | 2008-02-21Method of cooling a resistor
#8 | 2008-01-24Heat sink for integrated circuit devices
#9 | 2008-01-24Formation of metal-insulator-metal capacitor simultaneously with aluminum metal wiring level using a hardmask
#10 | 2007-12-20Inexpensive method of fabricating a higher performance capacitance density MIMcap integrable into a copper interconnect scheme
#11 | 2007-12-20Integrated thin-film resistor with direct contact
#12 | 2007-11-01Tunable temperature coefficient of resistance resistors and method of fabricating same
#13 | 2007-08-16RESISTOR TUNING
#14 | 2007-07-19Integrated thin-film resistor with direct contact
#15 | 2007-05-31Passive components in the back end of integrated circuits
#16 | 2007-05-03INTEGRATION SCHEME FOR HIGH GAIN FET IN STANDARD CMOS PROCESS
#17 | 2007-05-03REDUCED PARASITIC AND HIGH VALUE RESISTOR AND METHOD OF MANUFACTURE
#18 | 2007-03-22Process for single and multiple level metal-insulator-metal integration with a single mask
#19 | 2007-02-22Integrated BEOL thin film resistor
#20 | 2006-11-30Hi-K dielectric layer deposition methods
#21 | 2006-07-13Heat sink for integrated circuit devices
#22 | 2006-07-06Tunable temperature coefficient of resistance resistors and method of fabricating same
#23 | 2006-04-06Reduced guard ring in schottky barrier diode structure
#24 | 2006-01-31Damascene integration scheme for developing metal-insulator-metal capacitors
#25 | 2005-12-15Inexpensive method of fabricating a higher performance capacitance density MIMcap integrable into a copper interconnect scheme
#26 | 2005-12-08Formation of metal-insulator-metal capacitor simultaneously with aluminum metal wiring level using a hardmask
#27 | 2005-11-24Thin-film resistor and method of manufacturing the same
#28 | 2005-10-20Resistor tuning
#29 | 2005-10-06High tolerance TCR balanced high current resistor for RF CMOS and RF SiGe BiCMOS applications and cadenced based hierarchical parameterized cell design kit with tunable TCR and ESD resistor ballasting feature
#30 | 2005-09-06Prevention of Ta2O5 mim cap shorting in the beol anneal cycles
#31 | 2005-07-21High tolerance TCR balanced high current resistor for RF CMOS and RF SiGe BiCMOS applications and cadenced based hierarchical parameterized cell design kit with tunable TCR and ESD resistor ballasting feature
#32 | 2005-07-21Metal-insulator-metal capacitor and method of fabrication
#33 | 2005-03-31Metal-insulator-metal capacitor and method of fabrication
3218724 ⎘