Ming Jen Tzou

City:

Country:

United States

Published Applications:

Last publication date:

2012-08-02

Top Assignees for applications by Ming Jen Tzou

The entities that hold a legal rights for patent applications filed by inventor Tzou Ming Jen:

Ming Jen Tzou from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

Ultra thin copper foil with very low profile copper foil as carrier and its manufacturing method

InventorID:

3228009 ⎘