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Inventor profile of:

Tetsuya Watanabe

City:

Osaka-shi

Country:

Japan

Published Applications:

1

Last publication date:

2012-08-02

Top Assignees for applications by Tetsuya Watanabe

The entities that hold a legal rights for patent applications filed by inventor Watanabe Tetsuya:

KURARAY CO., LTD. 1 Kurashiki-shi, Japan
MARUISHI SANGYO CO., LTD. 1 Tokyo, Japan
MARUISHI SANGYO CO., LTD. 1 Shinagawa-ku, Japan

Recent patent applications by Watanabe Tetsuya

Tetsuya Watanabe from Osaka-shi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2012-08-02

US20120196515A1

Performing operations; transporting

Polishing pad

InventorID:

3228317 ⎘