Daniel H. Hecht

City:

Fort Worth, Texas

Country:

United States

Published Applications:

Last publication date:

2025-01-02

Top Assignees for applications by Daniel H. Hecht

The entities that hold a legal rights for patent applications filed by inventor Hecht Daniel H.:

LOCKHEED MARTIN CORPORATION 7 Bethesda, MD United States
Lockheed Martin Corporation 1 Menlo Park, CA United States

Recent patent applications by Hecht Daniel H.

Daniel H. Hecht from Fort Worth, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-01-02

US20250001647A1

Performing operations; transporting

RESIN INFUSED PI-SHAPED PREFORM AND JOINTS THEREOF

#2 | 2019-09-12

US20190276371A1

Chemistry; metallurgy

Engineered micro-voids for toughening ceramic composites

#3 | 2016-12-15

US20160361890A1

Performing operations; transporting

Composite materials with tapered reinforcements

#4 | 2016-11-03

US20160319135A1

Chemistry; metallurgy

Ultra high temperature environmental protection coating

#5 | 2013-07-04

US20130171441A1

Chemistry; metallurgy

Structural composite materials with high strain capability

#6 | 2012-11-01

US20120275879A1

Mechanical engineering

Fastening device

#7 | 2012-07-26

US20120189871A1

Mechanical engineering

Ultra high temperature environmental protection coating

#8 | 2010-10-28

US20100269880A1

Electricity

Integrated solar energy conversion system, method, and apparatus

#9 | 2010-02-04

US20100024975A1

Chemistry; metallurgy

Carbon/carbon film adhesive

InventorID:

323921 ⎘