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Inventor profile of:

Yuji Morishima

City:

Tokyo

Country:

Japan

Published Applications:

1

Last publication date:

2012-08-23

Top Assignees for applications by Yuji Morishima

The entities that hold a legal rights for patent applications filed by inventor Morishima Yuji:

SAMSUNG ELECTRONICS CO. LTD. 1 Suwon-si, Gyeonggi-do, South Korea
ADEKA CORPORATION 1 Tokyo, Japan

Recent patent applications by Morishima Yuji

Yuji Morishima from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2012-08-23

US20120211369A1

Chemistry; metallurgy

Copper electroplating method

InventorID:

3239504 ⎘