Rajneesh Kumar

City:

Poughkeepsie, New York

Country:

United States

Published Applications:

Last publication date:

2013-05-21

Top Assignees for applications by Rajneesh Kumar

The entities that hold a legal rights for patent applications filed by inventor Kumar Rajneesh:

INTERNATIONAL BUSINESS MACHINES CORPORATION 5 ARMONK, NY United States
IBM CORPORATION (YORKTOWN) 1 Yorktown Heights, NY United States
INTERNATIONAL BUSINESS MACHINES CORPORATION 1 Hopewell Junction, NY United States
INTERNATIONAL BUSINESS MACHINES CORPORATION 1 Yorktown Heights, NY United States

Recent patent applications by Kumar Rajneesh

Rajneesh Kumar from Poughkeepsie, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-05-21

US13362228

Uniform solder reflow fixture

#2 | 2012-08-30

US20120217287A1

Performing operations; transporting

Flip chip assembly method employing post-contact differential heating

#3 | 2010-07-22

US20100181663A1

Electricity

Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package

#4 | 2008-12-18

US20080311381A1

Electricity

Enhanced thermal conducting formulations

#5 | 2008-10-30

US20080266809A1

Electricity

Enhanced thermal conducting formulations

#6 | 2008-09-11

US20080220998A1

Electricity

Reversible thermal thickening grease

InventorID:

3244027 ⎘