Bucknell Chapman Webb

City:

Ossining, New York

Country:

United States

Published Applications:

Last publication date:

2012-08-30

Top Assignees for applications by Bucknell Chapman Webb

The entities that hold a legal rights for patent applications filed by inventor Webb Bucknell Chapman:

INTERNATIONAL BUSINESS MACHINES CORPORATION 6 ARMONK, NY United States
Hitachi Global Storage Technologies Netherlands B.V. 2 Amsterdam, Netherlands
INTERNATIONAL BUSINESS CORPORATION 1 Armonk, NY United States
International Business Machiness Corporation 1 Armonk, NY United States

Recent patent applications by Webb Bucknell Chapman

Bucknell Chapman Webb from Ossining, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2012-08-30

US20120217651A1

Electricity

Through substrate vias

#2 | 2011-09-15

US20110220020A1

Chemistry; metallurgy

Apparatus for an enhanced magnetic plating method

#3 | 2010-11-04

US20100276786A1

Electricity

Through substrate vias

#4 | 2010-07-29

US20100188774A1

Physics

Planar magnetic writer having offset portions

#5 | 2009-03-26

US20090079071A1

Electricity

Stress relief structures for silicon interposers

#6 | 2009-02-26

US20090050486A1

Chemistry; metallurgy

Enhanced magnetic plating method

#7 | 2005-05-24

US9723362

Method and apparatus for correcting for systematic errors in timing pattern generation

#8 | 2005-05-19

US20050105200A1

Physics

Method and apparatus for correcting for systematic errors in timing pattern generation

InventorID:

3244270 ⎘