Yangsoo Lee

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2012-12-27

Top Assignees for applications by Yangsoo Lee

The entities that hold a legal rights for patent applications filed by inventor Lee Yangsoo:

Yangsoo Lee from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

THERMOSETTING RESIN COMPOSITION, FLIP-CHIP MOUNTING ADHESIVE, SEMICONDUCTOR DEVICE FABRICATION METHOD, AND SEMICONDUCTOR DEVICE

Adhesive for semiconductor bonding, adhesive film for semiconductor bonding, method for mounting semiconductor chip, and semiconductor device

InventorID:

3280635 ⎘