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Inventor profile of:

Hiroki Mori

City:

Osaka

Country:

Japan

Published Applications:

10

Last publication date:

2022-12-15

Top Assignees for applications by Hiroki Mori

The entities that hold a legal rights for patent applications filed by inventor Mori Hiroki:

Sharp Kabushiki Kaisha 3 Osaka, Japan
SUMITOMO ELECTRIC INDUSTRIES, LTD. 3 Osaka, Japan
SUMITOMO ELECTRIC INDUSTRIES, LTD. 2 Osaka-shi, Japan
OSAKA WORKS OF SUMITOMO ELECTRIC INDUSTRIES, LTD. 1 Osaka-shi, Japan
EXEDY Friction Material Co., LTD 1 Amphur Muang, Thailand
Nissan Motor Co., Ltd 1 Kanagawa, Japan
SHARP KABUSHIKI KAISHA 1 Osaka-shi, Osaka, Japan
EXEDY CORPORATION 1 Osaka, Japan

Recent patent applications by Mori Hiroki

Hiroki Mori from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-12-15

US20220397802A1

OPTICAL MODULATOR AND METHOD OF MANUFACTURING OPTICAL MODULATOR

#2 | 2016-09-29

US20160281810A1

Mechanical engineering

Friction engagement element, dry clutch, and method of manufacturing friction engagement element

#3 | 2015-02-19

US20150048377A1

Semiconductor device, and manufacturing method for same

#4 | 2013-02-28

US20130048838A1

Semiconductor wafer, light-receiving element, light-receiving element array, hybrid-type detection device, optical sensor device, and process for production of semiconductor wafer

#5 | 2012-12-06

US20120305930A1

Semiconductor device, and manufacturing method for same

#6 | 2012-11-08

US20120282741A1

Method for manufacturing thin film transistor device

#7 | 2011-06-23

US20110147707A1

Detection device, photodiode array, and method for manufacturing the same

#8 | 2007-12-06

US20070280318A1

Semiconductor laser device and manufacturing method thereof

#9 | 2005-04-28

US20050087869A1

Semiconductor optical device, method of forming contact in semiconductor optical device

#10 | 2005-03-24

US20050062054A1

Semiconductor light emitting device

InventorID:

3291048 ⎘