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Inventor profile of:

Gary Stevens

City:

Surrey

Country:

United Kingdom

Published Applications:

30

Last publication date:

2015-03-26

Top Assignees for applications by Gary Stevens

The entities that hold a legal rights for patent applications filed by inventor Stevens Gary:

Recent patent applications by Stevens Gary

Gary Stevens from Surrey, GB has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2015-03-26
US20150087787A1
Chemistry; metallurgy

Polypropylene blends and processes for producing polymeric compositions

 #2 | 2013-07-11
US20130175068A1
Chemistry; metallurgy

Recyclable thermoplastic insulation with improved breakdown strength

 #3 | 2012-05-17
US20120118612A1
Chemistry; metallurgy

High thermal conductivity materials aligned within resins

 #4 | 2010-12-09
US20100311936A1
Electricity

High thermal conductivity materials with grafted surface functional groups

 #5 | 2010-11-04
US20100276628A1
Electricity

Insulation paper with high thermal conductivity materials

 #6 | 2010-09-23
US20100239851A1
Electricity

Nano and meso shell-core control of physical properties and performance of electrically insulating composites

 #7 | 2010-08-26
US20100215861A1
Electricity

Fabrics with high thermal conductivity coatings

 #8 | 2010-08-26
US20100213413A1
Chemistry; metallurgy

Seeding resins for enhancing the crystallinity of polymeric substructures

 #9 | 2010-05-13
US20100120928A1
Chemistry; metallurgy

MIX OF GRAFTED AND NON-GRAFTED PARTICLES IN A RESIN

 #10 | 2010-05-06
US20100112303A1
Performing operations; transporting

PATTERNING ON SURFACE WITH HIGH THERMAL CONDUCTIVITY MATERIALS

 #11 | 2010-05-06
US20100108278A1
Performing operations; transporting

Patterning on surface with high thermal conductivity materials

 #12 | 2009-09-24
US20090238959A1
Electricity

Fabrics with high thermal conductivity coatings

 #13 | 2008-10-23
US20080262128A1
Chemistry; metallurgy

Polymer brushes

 #14 | 2007-06-21
US20070141324A1
Electricity

Multi-layered platelet structure

 #15 | 2007-05-24
US20070114704A1
Textiles; paper

Treatment of micropores in mica materials

 #16 | 2007-02-01
US20070026221A1
Chemistry; metallurgy

Morphological forms of fillers for electrical insulation

 #17 | 2006-12-14
US20060281833A1
Chemistry; metallurgy

Mix of grafted and non-grafted particles in a resin

 #18 | 2006-12-14
US20060281380A1
Chemistry; metallurgy

Seeding resins for enhancing the crystallinity of polymeric substructures

 #19 | 2006-12-14
US20060280873A1
Electricity

Seeding of HTC fillers to form dendritic structures

 #20 | 2006-10-19
US20060234576A1
Performing operations; transporting

Patterning on surface with high thermal conductivity materials

 #21 | 2006-10-19
US20060231201A1
Performing operations; transporting

Composite insulation tape with loaded HTC materials

 #22 | 2005-12-15
US20050277721A1
Chemistry; metallurgy

High thermal conductivity materials aligned within resins

 #23 | 2005-12-15
US20050277351A1
Chemistry; metallurgy

Structured resin systems with high thermal conductivity fillers

 #24 | 2005-12-15
US20050277350A1
Electricity

Fabrics with high thermal conductivity coatings

 #25 | 2005-12-15
US20050277349A1
Chemistry; metallurgy

High thermal conductivity materials incorporated into resins

 #26 | 2005-12-15
US20050276977A1
Electricity

Diamond like carbon coating on nanofillers

 #27 | 2005-12-15
US20050274774A1
Electricity

Insulation paper with high thermal conductivity materials

 #28 | 2005-12-15
US20050274540A1
Electricity

Surface coating of lapped insulation tape

 #29 | 2005-12-15
US20050274450A1
Chemistry; metallurgy

Compression of resin impregnated insulating tapes

 #30 | 2005-11-03
US20050245644A1
Chemistry; metallurgy

High thermal conductivity materials with grafted surface functional groups
InventorID:

330435 ⎘