Cary, North Carolina
United States
18
2012-12-06
The entities that hold a legal rights for patent applications filed by inventor Edmond John A.:
John A. Edmond from Cary, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Light emitting diodes including barrier sublayers
#2 | 2011-07-28Nickel tin bonding system with barrier layer for semiconductor wafers and devices
#3 | 2010-11-04External extraction light emitting diode based upon crystallographic faceted surfaces
#4 | 2010-01-14Light emitting diodes including barrier layers/sublayers and manufacturing methods therefor
#5 | 2008-10-23Transparent ohmic contacts on light emitting diodes with carrier substrates
#6 | 2008-09-04Nickel tin bonding system with barrier layer for semiconductor wafers and devices
#7 | 2008-08-21Group III Nitride Diodes on Low Index Carrier Substrates
#8 | 2008-06-19Reflective mounting substrates for light emitting diodes
#9 | 2008-04-10Transparent ohmic contacts on light emitting diodes with growth substrates
#10 | 2008-03-27Modified gold-tin system with increased melting temperature for wafer bonding
#11 | 2008-01-03Nickel tin bonding system for semiconductor wafers and devices
#12 | 2007-09-13Light emitting diode with metal coupling structure
#13 | 2007-07-12Methods of manufacturing light emitting diodes including barrier layers/sublayers
#14 | 2007-05-24Light emitting diode with degenerate coupling structure
#15 | 2006-08-24External extraction light emitting diode based upon crystallographic faceted surfaces
#16 | 2005-09-20Robust group III light emitting diode for high reliability in standard packaging applications
#17 | 2005-09-08Light emitting diodes including barrier layers/sublayers
#18 | 2005-02-10Methods of treating a silicon carbide substrate for improved epitaxial deposition and resulting structures and devices
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