Paul M. Head

City:

Dedham, Massachusetts

Country:

United States

Published Applications:

Last publication date:

2012-12-13

Top Assignees for applications by Paul M. Head

The entities that hold a legal rights for patent applications filed by inventor Head Paul M.:

Paul M. Head from Dedham, US has applied for patents for these inventions. The list has both pending applications and granted patents:

POLYGON SHAPED POWER AMPLIFIER CHIPS

DIE ALIGNMENT WITH CRYSTALLOGRAPHIC AXES IN GaN-ON-SiC AND OTHER NON-CUBIC MATERIAL SUBSTRATES

InventorID:

3311641 ⎘