Susanne Leppack

City:

Dresden

Country:

Germany

Published Applications:

Last publication date:

2012-12-13

Top Assignees for applications by Susanne Leppack

The entities that hold a legal rights for patent applications filed by inventor Leppack Susanne:

Susanne Leppack from Dresden, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Copper interconnect with metal hardmask removal

RE-ESTABLISHING A HYDROPHOBIC SURFACE OF SENSITIVE LOW-K DIELECTRICS IN MICROSTRUCTURE DEVICES

Method for passivating exposed copper surfaces in a metallization layer of a semiconductor device

InventorID:

3313270 ⎘