Inventor profile of:

Erdem Matoglu

City:

Austin, Texas

Country:

United States

Published Applications:

16

Last publication date:

2012-12-27

Top Assignees for applications by Erdem Matoglu

The entities that hold a legal rights for patent applications filed by inventor Matoglu Erdem:

Recent patent applications by Matoglu Erdem

Erdem Matoglu from Austin, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2012-12-27
US20120327622A1
Electricity

Pre-distortion based impedence discontinuity remediation for via stubs and connectors in printed circuit board design

#2 | 2009-04-30
US20090107705A1
Electricity

Reducing noise coupling in high speed digital systems

#3 | 2009-04-30
US20090106976A1
Electricity

Method for reducing noise coupling in high speed digital systems

#4 | 2009-04-23
US20090102487A1
Physics

Method for validating printed circuit board materials for high speed applications

#5 | 2009-03-26
US20090079456A1
Physics

Apparatus, system, and method for integrated component testing

#6 | 2009-02-19
US20090049414A1
Electricity

METHOD AND SYSTEM FOR REDUCING VIA STUB RESONANCE

#7 | 2009-01-22
US20090021264A1
Physics

Method and apparatus for repeatable drive strength assessments of high speed memory DIMMs

#8 | 2009-01-06
US12127165
-

Bi-directional universal serial bus booster circuit

#9 | 2009-01-01
US20090007048A1
Electricity

DESIGN STRUCTURE FOR A COMPUTER MEMORY SYSTEM WITH A SHARED MEMORY MODULE JUNCTION CONNECTOR

#10 | 2008-10-23
US20080261451A1
Electricity

Pre-distortion based impedence discontinuity remediation for via stubs and connectors in printed circuit board design

#11 | 2008-07-01
US12023659
-

Bi-directional universal serial bus booster circuit

#12 | 2008-06-26
US20080155149A1
Physics

MULTI-PATH REDUNDANT ARCHITECTURE FOR FAULT TOLERANT FULLY BUFFERED DIMMS

#13 | 2008-06-12
US20080136427A1
Physics

On-chip probing apparatus

#14 | 2008-05-15
US20080112503A1
Electricity

Apparatus, system, and method for dynamic phase equalization in a communication channel

#15 | 2007-11-08
US20070257699A1
Physics

Multi-memory module circuit topology

#16 | 2007-08-02
US20070178289A1
Performing operations; transporting

High-speed routing composite material

InventorID:

3321039 ⎘