MANCHACA, Texas
United States
16
2011-01-06
The entities that hold a legal rights for patent applications filed by inventor MANGRUM MARC A.:
MARC A. MANGRUM from MANCHACA, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Method of making an integrated circuit package with shielding via ring structure
#2 | 2010-01-21Stackable molded packages and methods of making the same
#3 | 2009-12-31Test interposer having active circuit component and method therefor
#4 | 2009-11-19Method of packaging a semiconductor device and a prefabricated connector
#5 | 2009-11-19Package level ESD protection and method therefor
#6 | 2009-03-19Electromagnetic shield formation for integrated circuit die package
#7 | 2008-05-22Method of packaging a semiconductor device and a prefabricated connector
#8 | 2008-05-22Method of packaging a device using a dielectric layer
#9 | 2008-05-22METHOD OF PACKAGING A DEVICE HAVING A KEYPAD SWITCH POINT
#10 | 2008-05-22Method of packaging a device having a multi-contact elastomer connector contact area and device thereof
#11 | 2008-05-22Method of packaging a device having a tangible element and device thereof
#12 | 2008-05-08STACKABLE MOLDED PACKAGES AND METHODS OF MAKING THE SAME
#13 | 2007-12-13Methods and apparatus for a semiconductor device package with improved thermal performance
#14 | 2007-06-21Stackable molded packages and methods of making the same
#15 | 2006-10-19Structure having an integrated circuit on another integrated circuit with an intervening bent adhesive element
#16 | 2006-08-29Method for stacking an integrated circuit on another integrated circuit
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