Tokyo
Japan
13
2011-01-06
The entities that hold a legal rights for patent applications filed by inventor BABA Kazuhiro:
Kazuhiro BABA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package
#2 | 2009-06-25Semiconductor package board using a metal base
#3 | 2008-10-23Wiring board and semiconductor package using the same
#4 | 2006-11-02Semiconductor package board using a metal base
#5 | 2006-08-31Interconnecting substrate and semiconductor device
#6 | 2006-01-19Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package
#7 | 2005-12-22Sheet material and wiring board
#8 | 2005-11-17Wiring board and semiconductor package using the same
#9 | 2005-06-16Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device
#10 | 2005-05-12Semiconductor package board using a metal base
#11 | 2005-04-28Semiconductor device mounting board, method of manufacturing the same, method of inspecting the same, and semiconductor package
#12 | 2005-03-01Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device
#13 | 2005-01-11Semiconductor package board using a metal base
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