SINGAPORE
Singapore
15
2023-07-20
The entities that hold a legal rights for patent applications filed by inventor MA Hong:
Hong MA from SINGAPORE, SG has applied for patents for these inventions. The list has both pending applications and granted patents:
METHOD AND APPARATUS TO MITIGATE WORD LINE STAIRCASE ETCH STOP LAYER THICKNESS VARIATIONS IN 3D NAND DEVICES
#2 | 2022-12-22DUMMY WORDLINE CONTACTS TO IMPROVE ETCH MARGIN OF SEMI-ISOLATED WORDLINES IN STAIRCASE STRUCTURES
#3 | 2011-01-27Method of fabricating dual damascene structure
#4 | 2010-09-09Test pattern structure
#5 | 2010-02-18Method for forming an opening
#6 | 2009-12-24METHOD OF ETCHING A DIELECTRIC LAYER
#7 | 2009-10-15Method of controlling result parameter of IC manufacturing procedure
#8 | 2009-01-22Via-first interconnection process using gap-fill during trench formation
#9 | 2009-01-22INTERCONNECTION PROCESS
#10 | 2008-08-21Method of forming composite opening and method of dual damascene process using the same
#11 | 2008-07-17Method of fabricating dual damascene structure
#12 | 2008-07-03Two-step method for etching a fuse window on a semiconductor substrate
#13 | 2008-06-05Method for fabricating a dual damascene structure
#14 | 2007-01-11Method for eliminating bridging defect in via first dual damascene process
#15 | 2006-09-14Method of processing semiconductor wafer