Santa Clara, California
United States
48,646
2026-06-18
44,342
2026-06-16
Intel Corporation is an American multinational technology company based in Santa Clara, California. It is one of the world's largest semiconductor chip makers and is the inventor of the x86 series of microprocessors, the processors found in most personal computers. Intel supplies processors for computer system manufacturers such as Apple, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing.
These are the the leading inventors for applications assigned to INTEL CORPORATION:
INTEL CORPORATION based in Santa Clara, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
THROUGH GLASS VIAS WITH MULTILAYERED ORGANIC/INORGANIC LINER FOR INTEGRATED CIRCUIT DEVICE PACKAGES
#2 | 2026-06-18THROUGH GLASS VIA STRUCTURES INCLUDING AN ORGANIC SEED MATERIAL LAYER FOR INTEGRATED CIRCUIT DEVICE PACKAGES
#3 | 2026-06-18METHODS AND ARCHITECTURES FOR MULTI-LAYER FILLED THROUGH-GLASS VIAS (TGVs)
#4 | 2026-06-18BOTTOM-UP PLATING OF THROUGH-GLASS VIAS
#5 | 2026-06-18ANOMALOUS HALL EFFECT (AHE)-BASED READ OUT OF LOGIC DEVICES BASED ON INTERLAYER EXCHANGE COUPLING
#6 | 2026-06-18ARCHITECTURES AND METHODS FOR DIFFERENTIAL CMOS CONTACT PROFILES
#7 | 2026-06-18MERGED NANORIBBON-BASED TRANSISTOR ALONG NANOCOMB TRANSISTOR RIBBON PATH
#8 | 2026-06-18LINED SOURCE/DRAIN REGIONS IN INTEGRATED CIRCUIT STRUCTURES
#9 | 2026-06-18BOTTOM-UP PLATING OF THROUGH-GLASS VIAS
#10 | 2026-06-18APPARATUS AND METHOD FOR MECHANISM ENHANCEMENT FOR WIFI
#11 | 2026-06-18ENHANCED WI-FI SENSING MEASUREMENT SETUP AND SENSING TRIGGER FRAME FOR RESPONDER-TO-RESPONDER SENSING
#12 | 2026-06-18TELEMETRY RESTRICTION MECHANISM
#13 | 2026-06-18GRAPHICS PROCESSING UNIT PROCESSING AND CACHING IMPROVEMENTS
#14 | 2026-06-18NEURAL NETWORK SCHEDULING MECHANISM
#15 | 2026-06-18TECHNOLOGIES FOR PHOTONIC INTEGRATED CIRCUITS FOR QUBIT CONTROL AND READOUT
#16 | 2026-06-18DEVICE, METHOD AND SYSTEM TO PROVIDE OPERAND INFORMATION WITH A BYPASS CACHE AND A PHYSICAL REGISTER FILE
#17 | 2026-06-18DEVICE, METHOD AND SYSTEM FOR ENABLING A REGION-SPECIFIC PREFETCH FILTER
#18 | 2026-06-18WRITE-ONCE-READ-MANY CACHE
#19 | 2026-06-18CHUNKY PARTIAL LOAD TO STORE FORWARDING FOR PIPELINE LOADS
#20 | 2026-06-18APPARATUS AND METHOD FOR PERFORMING AN ATTENTION OPERATION ON A HETEROGENEOUS PROCESSOR PLATFORM
#21 | 2026-06-18DEVICE, METHOD AND SYSTEM FOR SPECULATIVE EXECUTION OF A DEPENDENT INSTRUCTION
#22 | 2026-06-18DEVICE, METHOD AND SYSTEM FOR CONTROLLING MICRO-OPERATION SERIALIZATION WITH RESERVATION STATIONS
#23 | 2026-06-18MISALIGNED MEMORY ACCESSES TO AN ADDRESS-SLICED CACHE
#24 | 2026-06-18TABLE OF COMMON REGISTER VALUES FOR LOWER-COST INJECTION OF PREDICTED DATA VALUES INTO THE PROCESSOR CORE
#25 | 2026-06-18DEVICE, METHOD AND SYSTEM FOR CROSS-CLUSTER COMMUNICATION OF OPERAND VALUES
#26 | 2026-06-18MEMORY RENAMING USING ADDRESS SIGNATURES
#27 | 2026-06-18VECTOR-INTEGER STORE DATA AVOIDANCE SCHEME
#28 | 2026-06-16 ✅ Patent 12,660,604 granted on 2026-06-16Technologies for back side structures on a quantum processor die
#29 | 2026-06-11BOTTOM-UP THROUGH GLASS VIA PLATING WITH COATED LIQUID ADHESIVE ON GLASS SUBSTRATE
#30 | 2026-06-11DIODE STRUCTURE WITH ADJACENT BASE REGIONS
#31 | 2026-06-11UNDERHUNG CACHE STACKED CHIPLET ON GLASS CORE
#32 | 2026-06-11THROUGH GLASS VIA LOCAL STRESS REDUCTION
#33 | 2026-06-11METHODS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CONTROL A MICRO-LED DISPLAY
#34 | 2026-06-11METHOD AND APPARATUS FOR VIEWPORT SHIFTING OF NON-REAL TIME 3D APPLICATIONS
#35 | 2026-06-11IMAGE TOKEN PRUNING FOR MULTIMODAL FOUNDATION MODELS
#36 | 2026-06-11RECOVERY PATH CACHE
#37 | 2026-06-11CREDIT-BASED TECHNIQUES AND MECHANISMS FOR DETERMINING AN ENABLEMENT STATE OF A PREFETCH FILTER
#38 | 2026-06-11LOW POWER INFERENCE ENGINE PIPELINE IN A GRAPHICS PROCESSING UNIT
#39 | 2026-06-11SHORT FORWARD BRANCH PREDICTOR
#40 | 2026-06-11BRANCH HISTORY BASED INSTRUCTION PREFETCHING
#41 | 2026-06-11CONSERVING INSTRUCTION ENCODING SPACE AND MINIMIZING CODE SIZE FOR MEMORY OPERATIONS USING PREFIX BITS TO DISTINGUISH LOAD AND STORE TAG CHECKS
#42 | 2026-06-11DECOUPLED ORDERED MICRO SEQUENCER
#43 | 2026-06-11SELECTIVELY CONTROLLABLE MEMORY TAG CHECKING
#44 | 2026-06-11DEVICE, METHOD AND SYSTEM FOR FILTERING PREFETCHES BASED ON A RECORD OF AN ACCESS HISTORY
#45 | 2026-06-11AUTONOMOUS VEHICLE SYSTEM
#46 | 2026-06-04APPARATUS AND METHOD FOR SECONDARY FAN SPEED CONTROL
#47 | 2026-06-04SCHEDULING AVAILABILITY FOR USER EQUIPMENT SUPPORTING MULTI-RECEIVER SIMULTANEOUS RECEPTION
#48 | 2026-06-04RESILIENT RADIO RESOURCE PROVISIONING FOR NETWORK SLICING
#49 | 2026-06-04ENHANCED REAL-TIME VISUAL QUALITY METRIC GENERATION FOR VIDEO CODING
#50 | 2026-06-04BACKGROUND REPLACEMENT IN VIDEO CONFERENCE WITH OCCLUDED BACKGROUND PRIOR
#51 | 2026-06-04CONFIGURABLE PROCESSOR ELEMENT ARRAYS FOR IMPLEMENTING CONVOLUTIONAL NEURAL NETWORKS
#52 | 2026-06-04MEMORY PRESERVED WARM RESET MECHANSIM
#53 | 2026-06-04APPARATUS AND METHOD FOR WARM RESET CUSTOMIZATION ON FIRMWARE FAILURES
#54 | 2026-06-04LAZY RETURN STACK BUFFER MIGRATION
#55 | 2026-06-04APPARATUS AND METHOD FOR CONFIGURING OPERATIONAL BOUNDARIES FOR BINNED PROCESSOR CHIPS
#56 | 2026-05-28NANORIBBON-BASED TRANSISTOR FABRICATION TECHNIQUES INCLUDING SACRIFICIAL LAYER OVER TOP NANORIBBON
#57 | 2026-05-28LOSSLESS COMPRESSION OF LLM PARAMETERS WITH GROUPED HUFFMAN ENCODING
#58 | 2026-05-28SYSTEM(S), METHOD(S) AND APPARATUS FOR JOINTLY PERFORMING RETRIEVAL AUGMENTED GENERATION AND AI MODEL FINE-TUNING
#59 | 2026-05-28QUERY-AWARE MULTI-STAGE GRAPH CONTROL FOR RETRIEVAL-AUGMENTED GENERATION SYSTEMS
#60 | 2026-05-28APPARATUS AND METHOD FOR UNCERTAINTY-AWARE CODE GENERATION USING LARGE LANGUAGE MODELS (LLMS)
#61 | 2026-05-21ENHANCED RADIO ACCESS NETWORK SYSTEMS AND METHODS FOR BEAM-BASED LOW-POWER WAKE-UP SIGNAL TRANSMISSION IN WIRELESS COMMUNICATIONS
#62 | 2026-05-21MANAGEMENT OF DATA BURSTS IN NETWORK PROCESSING
#63 | 2026-05-21ENHANCED RADIO ACCESS NETWORK BEAM SIGNALING AND BEAM FAILURE RECOVERY FOR MULTIPLE TRANSMIT/RECEIVE POINT WIRELESS OPERATIONS
#64 | 2026-05-21APPARATUS AND METHOD FOR INTEGRATED DEVICES WITH TRUSTED EXECUTION ENVIRONMENT (TEE) CONFIDENTIAL COMPUTE SUPPORT
#65 | 2026-05-21INTEGRATED CIRCUIT COMPONENT DIAGNOSIS USING REAL-TIME SENSOR-BASED VIOLATION INFORMATION
#66 | 2026-05-14MICROELECTRONIC ASSEMBLIES INCLUDING A PARTIAL LINER IN THROUGH-GLASS VIAS
#67 | 2026-05-14INTEGRATED CIRCUIT PACKAGES INCLUDING A SURFACE REDISTRIBUTED INTERCONNECT BRIDGE FOR DIE-TO-DIE INTERCONNECTS
#68 | 2026-05-14MICROELECTRONIC ASSEMBLIES INCLUDING A PHOTOPOLYMER LINER IN THROUGH-GLASS VIAS
#69 | 2026-05-14APPARATUS AND METHODS FOR COPPER-NTE (NEGATIVE THERMAL EXPANSION) FILLED THROUGH-GLASS VIAS
#70 | 2026-05-14SELECTIVE BACKSIDE RECESSING OF SOURCE AND DRAIN REGIONS
#71 | 2026-05-14GROUP ADDRESSED BUFFERABLE UNITS (BUS) INDICATION IN TRAFFIC INDICATION MAP (TIM) FOR MULTI-LINK OPERATION
#72 | 2026-05-14METHODS AND APPARATUS TO ENABLE PRIVATE VERBAL SIDE CONVERSATIONS IN VIRTUAL MEETINGS
#73 | 2026-05-14INCREMENTAL 2D-TO-3D POSE LIFTING FOR FAST AND ACCURATE HUMAN POSE ESTIMATION
#74 | 2026-05-14METHODS AND APPARATUS TO PROVIDE EFFICIENT TRACKING OF COMPUTER RESOURCE UTILIZATION
#75 | 2026-05-14TIME BASED TELEMETRY FOR NETWORKED DEVICES
#76 | 2026-05-14ELECTRICAL AND PHOTONIC INTEGRATED CIRCUITS ARCHITECTURE
#77 | 2026-05-07MICROELECTRONIC ASSEMBLIES INCLUDING MULTIPLE LINERS IN THROUGH-GLASS VIAS
#78 | 2026-05-07CONTROL CHANNEL FOR WI-FI
#79 | 2026-05-07METHODS AND ARRANGEMENTS TO SUPPORT CHANNEL BANDWIDTHS
#80 | 2026-05-07COORDINATION AND INCREASED UTILIZATION OF GRAPHICS PROCESSORS DURING INFERENCE
#81 | 2026-05-07SYSTEMS AND METHODS FOR CALIBRATING SEMICONDUCTOR PROCESS EMULATION MODELS
#82 | 2026-05-07APPARATUS AND METHOD FOR EFFICIENT SCHEDULING OF ACCELERATOR WORKLOADS
#83 | 2026-05-07DATA PREFETCHING BASED ON BOTH INTRA-TILE AND INTER-TILE STRIDE INFORMATION
#84 | 2026-04-30BOTTOM-UP ELECTROPLATED VIAS FOR PACKAGE SUBSTRATES AND RELATED METHODS
#85 | 2026-04-30INTEGRATED CIRCUIT PACKAGES HAVING TOPSIDE POWER DELIVERY IN 3 DIMENSIONAL DIE STACKS
#86 | 2026-04-30LIQUID COOLING FOR INTEGRATED CIRCUIT PACKAGES
#87 | 2026-04-30APPARATUSES USED IN AP MLD AND NON-AP MLD
#88 | 2026-04-30APPARATUS, SYSTEM, AND METHOD OF BEACON TRANSMISSION TIME SHIFT
#89 | 2026-04-30APPARATUS USED IN NON-AP STA
#90 | 2026-04-30APPARATUS USED IN NON-AP STA
#91 | 2026-04-30ENHANCED IN-BAND ACTIVATION AND PROVISIONING OF DEVICES FOR OPENROAMING NETWORKS
#92 | 2026-04-30USER INTERFACES FOR ELECTRONIC DEVICES
#93 | 2026-04-30POINT CLOUD CODING STANDARD CONFORMANCE DEFINITION IN COMPUTING ENVIRONMENTS
#94 | 2026-04-30HARDWARE-ACCELERATED INTRA FRAME ENCODING
#95 | 2026-04-30SCRAMBLING OF PIXEL DATA FOR VIDEO ENCRYPTION
#96 | 2026-04-30APPARATUS, SYSTEM, AND METHOD OF A TRANSMIT SECTOR SWEEP (TXSS) PROCEDURE OVER A MILLIMETERWAVE (MMWAVE) WIRELESS COMMUNICATION CHANNEL
#97 | 2026-04-30FRACTIONAL FILTERS FOR CONVOLUTIONAL NEURAL NETWORK PROCESSING
#98 | 2026-04-30SYSTEM AND METHOD PROVIDING BITPLANE RANGE COMPRESSION
#99 | 2026-04-30COMMUNICATION OPTIMIZATIONS FOR DISTRIBUTED MACHINE LEARNING
#100 | 2026-04-30 ✅ Patent 12,619,761 granted on 2026-05-05INSTRUCTION EXECUTION THAT BROADCASTS AND MASKS DATA VALUES AT DIFFERENT LEVELS OF GRANULARITY
Also check out Intel Corporation's (Santa Clara, United States) applicant profile with 30,003 patent applications submitted.
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