Setsuyu Hayakawa

City:

Aichi

Country:

Japan

Published Applications:

Last publication date:

2011-02-24

Top Assignees for applications by Setsuyu Hayakawa

The entities that hold a legal rights for patent applications filed by inventor Hayakawa Setsuyu:

Setsuyu Hayakawa from Aichi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Mold release agent and casting method

Carburized metal material and producing method thereof

InventorID:

3341908 ⎘