William CHENG

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2014-05-01

Top Assignees for applications by William CHENG

The entities that hold a legal rights for patent applications filed by inventor CHENG William:

William CHENG from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

Structure of wafer level chip molded package

Multi-project wafer and method of making same

Structure and method of wafer level chip molded packaging

Multi-project wafer and method of making same

InventorID:

3348928 ⎘