Daniel Wayne Corbett

City:

Corning, New York

Country:

United States

Published Applications:

Last publication date:

2011-03-03

Top Assignees for applications by Daniel Wayne Corbett

The entities that hold a legal rights for patent applications filed by inventor Corbett Daniel Wayne:

CORNING INCORPORATED 1 Corning, NY United States

Recent patent applications by Corbett Daniel Wayne

Daniel Wayne Corbett from Corning, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2011-03-03

US20110052745A1

Performing operations; transporting

Honeycomb extrusion die apparatus

InventorID:

3351553 ⎘