Benson LIU

City:

Taipei

Country:

Taiwan

Published Applications:

Last publication date:

2012-10-25

Top Assignees for applications by Benson LIU

The entities that hold a legal rights for patent applications filed by inventor LIU Benson:

Benson LIU from Taipei, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

Package structures

Package structures

Bond pad design for fine pitch wire bonding

Test structure for seal ring quality monitor

Package structures

InventorID:

3355893 ⎘