Gerd Marxsen

Reduced defectivity in contacts of a semiconductor device comprising replacement gate electrode structures by using an intermediate cap layer

Semiconductor device formed by a replacement gate approach based on an early work function metal

Superior fill conditions in a replacement gate approach by performing a polishing process based on a sacrificial fill material

METHOD OF REDUCING NON-UNIFORMITIES DURING CHEMICAL MECHANICAL POLISHING OF MICROSTRUCTURE DEVICES BY USING CMP PADS IN A GLAZED MODE

System and method for optical endpoint detection during CMP by using an across-substrate signal

CMP system and method using individually controlled temperature zones

Polishing head using zone control

METHOD AND SYSTEM FOR CONTROLLING CHEMICAL MECHANICAL POLISHING BY TAKING ZONE SPECIFIC SUBSTRATE DATA INTO ACCOUNT

Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing step

Technique for electrochemically depositing an alloy having a chemical order

Method for forming a defined recess in a damascene structure using a CMP process and a damascene structure

Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent CMP process

Method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner