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Inventor profile of:

Kunio Mori

City:

Iwate

Country:

Japan

Published Applications:

2

Last publication date:

2022-06-30

Recent patent applications by Mori Kunio

Kunio Mori from Iwate, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-06-30

US20220204831A1

Chemistry; metallurgy

THERMALLY CONDUCTIVE SILICONE COMPOSITION, SHEET USING THE SAME, AND METHOD FOR PRODUCING THE SHEET

#2 | 2011-05-05

US20110104505A1

Performing operations; transporting

LAMINATED BODY AND CIRCUIT WIRING BOARD

InventorID:

3374790 ⎘