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Inventor profile of:

John D. Summers

City:

Chapel Hill, North Carolina

Country:

United States

Published Applications:

Last publication date:

2016-02-04

Top Assignees for applications by John D. Summers

The entities that hold a legal rights for patent applications filed by inventor Summers John D.:

E. I. DU PONT DE NEMOURS AND COMPANY 9 Wilmington, DE United States
CDA Processing Limited Liability Company 3 Wilmington, DE United States
E.I. DU PONT DE NEMOURS AND COMPANY 2 Wilmington, DE United States
DuPont Toray Co., Ltd. 1 Tokyo, Japan
E.I. DU PONT DE NEMOURS AND COMPANY Patents Records Center/Dupont Legal 1 Wilmngton, Germany

Recent patent applications by Summers John D.

John D. Summers from Chapel Hill, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2016-02-04

US20160035455A1

Electricity

PHOTONIC SINTERING OF POLYMER THICK FILM COPPER CONDUCTOR COMPOSITIONS

#2 | 2015-08-13

US20150228374A1

Electricity

THERMALLY CONDUCTIVE ELECTRONIC SUBSTRATES AND METHODS RELATING THERETO

#3 | 2014-12-18

US20140367619A1

Electricity

Photonic sintering of polymer thick film copper conductor compositions

#4 | 2014-06-19

US20140170334A1

Electricity

Conductive metal composition

#5 | 2013-07-18

US20130180583A1

Electricity

CONDUCTIVE PASTE FOR FINE-LINE HIGH-ASPECT-RATIO SCREEN PRINTING IN THE MANUFACTURE OF SEMICONDUCTOR DEVICES

#6 | 2012-06-07

US20120138871A1

Chemistry; metallurgy

Ink jettable silver/silver chloride compositions

#7 | 2010-04-08

US20100085680A1

Electricity

CRYSTALLINE ENCAPSULANTS

#8 | 2010-03-18

US20100067168A1

Electricity

Composite organic encapsulants

#9 | 2009-06-04

US20090141425A1

Electricity

Screen-printable encapsulants based on soluble polybenzoxazoles

#10 | 2009-01-22

US20090023858A1

Electricity

Screen-printable encapsulants based on polyhydroxyamides that thermally convert to polybenzoxazoles

#11 | 2008-08-07

US20080185561A1

Electricity

Resistor compositions for electronic circuitry applications

#12 | 2008-08-07

US20080185361A1

Electricity

Compositions for electronic circuitry applications and methods relating thereto

#13 | 2008-05-22

US20080118633A1

Electricity

Methods for creating electronic circuitry comprising phenolic epoxy binder compositions

#14 | 2007-12-20

US20070291440A1

Electricity

Organic encapsulant compositions based on heterocyclic polymers for protection of electronic components

#15 | 2007-12-20

US20070290379A1

Chemistry; metallurgy

Hydrophobic compositions for electronic applications

#16 | 2007-10-18

US20070244267A1

Electricity

Hydrophobic crosslinkable compositions for electronic applications

#17 | 2007-10-11

US20070236859A1

Electricity

Organic encapsulant compositions for protection of electronic components

#18 | 2007-04-12

US20070083017A1

Electricity

Composition of polyimide and sterically-hindered hydrophobic epoxy

#19 | 2005-07-14

US20050154181A1

Chemistry; metallurgy

Polyimide compositions having resistance to water sorption, and methods relating thereto

#20 | 2005-07-14

US20050154105A1

Electricity

Compositions with polymers for advanced materials

#21 | 2005-06-21

US10343277

Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate

InventorID:

339596 ⎘