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Inventor profile of:

Shin OHYA

City:

Country:

United States

Published Applications:

1

Last publication date:

2011-06-09

Top Assignees for applications by Shin OHYA

The entities that hold a legal rights for patent applications filed by inventor OHYA Shin:

The University of Tokyo 1 Tokyo, Japan
Kisco Ltd. 1 Osaka-Shi, Osaka, Japan
Daisan Kasei Co., Ltd. 1 Tokyo, Japan

Recent patent applications by OHYA Shin

Shin OHYA from , US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2011-06-09

US20110136234A1

Chemistry; metallurgy

Cell culture substrate and its production method

InventorID:

3397758 ⎘