Tokyo
Japan
82
2026-04-09
The entities that hold a legal rights for patent applications filed by inventor Uno Tomohiro:
Tomohiro Uno from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
#2 | 2025-12-11Al ALLOY BONDING WIRE
#3 | 2025-12-04BONDING WIRE FOR SEMICONDUCTOR DEVICES
#4 | 2024-09-19AI BONDING WIRE FOR SEMICONDUCTOR DEVICES
#5 | 2024-08-08Bonding wire for semiconductor devices
#6 | 2024-04-04AI WIRING MATERIAL
#7 | 2024-03-28AI WIRING MATERIAL
#8 | 2024-02-29Al BONDING WIRE FOR SEMICONDUCTOR DEVICES
#9 | 2023-12-14Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
#10 | 2023-09-28Al WIRING MATERIAL
#11 | 2023-09-21Al WIRING MATERIAL
#12 | 2023-05-18Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE
#13 | 2023-05-11BONDING WIRE FOR SEMICONDUCTOR DEVICES
#14 | 2023-05-11AL BONDING WIRE
#15 | 2023-05-11AL BONDING WIRE
#16 | 2023-04-06COPPER BONDING WIRE
#17 | 2023-01-19Copper alloy bonding wire for semiconductor devices
#18 | 2023-01-19COPPER BONDING WIRE FOR SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE
#19 | 2022-10-27AL WIRING MATERIAL
#20 | 2022-08-25Ag alloy bonding wire for semiconductor device
#21 | 2022-05-19Bonding wire
#22 | 2022-05-19Al bonding wire
#23 | 2022-04-07BONDING WIRE FOR SEMICONDUCTOR DEVICES
#24 | 2021-04-08COMPOSITE CERAMIC LAYERED BODY AND MANUFACTURING METHOD
#25 | 2021-02-11Cu alloy bonding wire for semiconductor device
#26 | 2020-11-26Bonding wire for semiconductor device
#27 | 2020-10-01COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
#28 | 2020-09-03Cu alloy bonding wire for semiconductor device
#29 | 2020-05-28Cu alloy bonding wire for semiconductor device
#30 | 2020-04-23Selective emitter for thermophotovoltaic power generator
#31 | 2020-03-05Ceramic laminate, ceramic insulating substrate, and method for manufacturing ceramic laminate
#32 | 2020-01-09BONDING WIRE FOR SEMICONDUCTOR DEVICE
#33 | 2020-01-09Cu alloy core bonding wire with Pd coating for semiconductor device
#34 | 2019-10-24Bonding wire for semiconductor device
#35 | 2019-05-30Cu alloy core bonding wire with Pd coating for semiconductor device
#36 | 2019-02-28THERMOPHOTOVOLTAIC CONVERSION MEMBER
#37 | 2019-02-28Ceramic laminate
#38 | 2018-12-27Bonding wire for semiconductor devices
#39 | 2018-12-27Bonding wire for semiconductor device
#40 | 2018-10-04Ferritic stainless steel foil
#41 | 2018-08-23Austenitic stainless steel foil
#42 | 2018-08-16Stainless steel foil
#43 | 2018-05-17Bonding wire for semiconductor device
#44 | 2018-05-10Bonding wire for semiconductor device
#45 | 2018-05-03Bonding wire for semiconductor device
#46 | 2018-04-05Method for forming ball in bonding wire
#47 | 2018-02-01CONDUCTIVE JOINING MATERIAL AND CONDUCTIVE JOINING STRUCTURE WHICH USE METAL PARTICLES AND CONDUCTIVE MATERIAL PARTICLES
#48 | 2017-12-21Bonding wire for semiconductor device
#49 | 2017-11-16Oriented copper plate, copper-clad laminate, flexible circuit board, and electronic device
#50 | 2017-11-09Bonding wire for semiconductor device
#51 | 2017-11-02CONDUCTIVE BONDED ASSEMBLY OF ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE USING SAME, AND METHOD OF PRODUCTION OF CONDUCTIVE BONDED ASSEMBLY
#52 | 2017-08-03Bonding wire for semiconductor device
#53 | 2017-07-13Bonding wire for semiconductor device
#54 | 2017-07-13Bonding wire for semiconductor device
#55 | 2017-07-06Bonding wire for semiconductor device
#56 | 2017-06-22Bonding wire for semiconductor device
#57 | 2017-04-27Cu alloy core bonding wire with Pd coating for semiconductor device
#58 | 2017-04-20Silver bonding wire for semiconductor device containing indium, gallium, and/or cadmium
#59 | 2017-02-09Bonding wire for semiconductor device
#60 | 2016-10-27Bonding wire for semiconductor devices
#61 | 2016-04-21Bonding wire for semiconductor device use and method of production of same
#62 | 2016-04-14Bonding wire for semiconductor device use and method of production of same
#63 | 2013-11-21Bonding wire for semiconductor
#64 | 2013-10-31SEMICONDUCTOR DEVICE
#65 | 2013-08-15SEMICONDUCTOR DEVICE HAVING CAPACITOR INCLUDING HIGH-K DIELECTRIC
#66 | 2013-07-18Bonding structure of multilayer copper bonding wire
#67 | 2012-11-29Copper bonding wire for semiconductor device and bonding structure thereof
#68 | 2012-05-17BONDING WIRE FOR SEMICONDUCTOR
#69 | 2012-05-03Bonding wire for semiconductor device
#70 | 2012-04-19Copper alloy bonding wire for semiconductor
#71 | 2011-08-25ALD FILM-FORMING APPARATUS AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE
#72 | 2011-05-26Bonding wire for semiconductor
#73 | 2011-05-05Bonding structure of bonding wire
#74 | 2011-01-20Bonding wire for semiconductor devices
#75 | 2011-01-20Copper alloy bonding wire for semiconductor device
#76 | 2010-12-30Semiconductor device bonding wire and wire bonding method
#77 | 2010-11-25Bonding wire for semiconductor devices
#78 | 2010-11-11Bonding wire for semiconductor device
#79 | 2009-03-19Semiconductor mounting bonding wire
#80 | 2008-07-24Method for fabricating a cylindrical capacitor including implanting impurities into the upper sections of the lower electrode to prevent the formation of hemispherical grain silicon on the upper sections
#81 | 2008-03-13Copper alloy bonding wire for semiconductor device
#82 | 2007-11-22Semiconductor device including a capacitor having reduced leakage current
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