Tokyo
Japan
12
2011-10-13
The entities that hold a legal rights for patent applications filed by inventor Karasawa Jun:
Jun Karasawa from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Thermoelectric module and power generation apparatus
#2 | 2011-06-16Thermoelectric device and thermoelectric module
#3 | 2008-07-03PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE
#4 | 2008-06-26METHOD OF INSPECTING PRINTED WIRING BOARD AND PRINTED WIRING BOARD
#5 | 2008-05-29MULTILAYERED PRINTED-WIRING BOARD AND INTER-LAYER CONNECTING METHOD THEREOF
#6 | 2007-12-06Printed wiring board, its bending method, and electronic apparatus
#7 | 2007-12-06Component-embedded printed wiring board, manufacturing method for component-embedded printed wiring board, and electronic apparatus
#8 | 2007-12-06Printed wiring board, its manufacturing method, and electronic equipment
#9 | 2007-12-04Image pickup apparatus, method of making, and electric apparatus having image pickup apparatus
#10 | 2007-10-04Printed-wiring board with built-in component, manufacturing method of printed-wiring board with built-in component, and electronic device
#11 | 2007-09-27Printed-wiring board with built-in component, manufacturing method of printed-wiring board with built-in component, and electronic device
#12 | 2007-08-30Printed-wiring board with built-in component, manufacturing method of printed-wiring board with built-in component, and electronic device
3400351 ⎘