Todd R. Salamon

City:

Summit, New Jersey

Country:

United States

Published Applications:

Last publication date:

2011-06-23

Top Assignees for applications by Todd R. Salamon

The entities that hold a legal rights for patent applications filed by inventor Salamon Todd R.:

Todd R. Salamon from Summit, US has applied for patents for these inventions. The list has both pending applications and granted patents:

HEAT-TRANSFER ARRANGEMENT FOR ENCLOSED CIRCUIT BOARDS

Thermal interface device

Circuit pack cooling solution

InventorID:

3408397 ⎘