Tab A. STEPHENS

Microelectronic assembly having a heat spreader for a plurality of die

Wirebond recess for stacked die

Stacked semiconductor devices

Optical wafer and die probe testing

Die stack with optical TSVs

Optical die test interface with separate voltages for adjacent electrodes

Optical redundancy

Optical backplane mirror

Integration of a MEMS beam with optical waveguide and deflection in two dimensions

Communication system die stack

Gate security feature

Microelectronic assembly having a heat spreader for a plurality of die

Techniques for reducing inductance in through-die vias of an electronic assembly

Methods and structures for reducing heat exposure of thermally sensitive semiconductor devices

Methods and structures for reducing heat exposure of thermally sensitive semiconductor devices

Semiconductor devices with nonconductive vias

FinFET structure with contacts

Process of forming a non-volatile memory cell including a capacitor structure

Semiconductor fabrication process including recessed source/drain regions in an SOI wafer

Plasma enhanced nitride layer

Method of forming a semiconductor device having a metal layer

Decoupled complementary mask patterning transfer method

Method for forming a semiconductor device having a silicide layer

Semiconductor device incorporating a defect controlled strained channel structure and method of making the same

Confined spacers for double gate transistor semiconductor fabrication process

Semiconductor device incorporating a defect controlled strained channel structure and method of making the same