Campbell, California
United States
23
2024-01-23
The entities that hold a legal rights for patent applications filed by inventor Baer Amanda:
Amanda Baer from Campbell, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Cross track current design for energy assisted magnetic recording
#2 | 2011-06-23Magnetic write head manufactured by an enhanced damascene process producing a tapered write pole with a non-magnetic spacer and non-magnetic bump
#3 | 2010-06-24Methods for creating a stepped perpendicular magnetic pole via milling and/or metal liftoff
#4 | 2010-06-24Methods for creating slanted perpendicular magnetic pole via metal liftoff
#5 | 2010-06-24Method for creating a magnetic write pole having a stepped perpendicular pole via CMP-assisted liftoff
#6 | 2009-06-18Magnetic write pole fabrication
#7 | 2009-05-26Method of fabrication for slider with underpass leads
#8 | 2008-06-26Enhanced planarization liftoff structure and method for making the same
#9 | 2008-06-19Optical lapping guide for use in the manufacture of perpendicular magnetic write heads
#10 | 2008-05-15Methods for the manufacture of notched trailing shields
#11 | 2007-11-15Method of manufacturing a perpendicular magnetic recording write head with notched trailing shield
#12 | 2007-11-08Perpendicular magnetic write head having a magnetic write pole with a concave trailing edge
#13 | 2007-10-25Process to open connection vias on a planarized surface
#14 | 2007-10-25Method for making a perpendicular magnetic recording write head
#15 | 2007-06-28Method for fabricating a side shield for a flux guide layer for perpendicular magnetic recording
#16 | 2006-10-19Method to planarize perpendicular write poles using a combination of CMP and reactive ion milling
#17 | 2006-05-11Simultaneous planarization of pole piece and coil materials for write head applications
#18 | 2006-04-11Simultaneous planarization of pole piece and coil materials for write head applications
#19 | 2006-04-06Process for creating a write head by forming a bump after the top pole is formed
#20 | 2005-12-29Slider with underpass lead configured as a cooling plate
#21 | 2005-12-01Method for enhancing wafer alignment marks
#22 | 2005-11-03High milling resistance write pole fabrication method for perpendicular recording
#23 | 2005-03-03Method of fabricating electronic component using resist structure with no undercut
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