Austin, Texas
United States
13
2011-06-23
The entities that hold a legal rights for patent applications filed by inventor Chatterjee Ritwik:
Ritwik Chatterjee from Austin, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Method to form a via
#2 | 2010-12-303-D semiconductor die structure with containing feature and method
#3 | 2009-07-30Method for forming a through silicon via layout
#4 | 2009-07-09Micropad formation for a semiconductor
#5 | 2009-07-02Forming a 3-D semiconductor die structure with an intermetallic formation
#6 | 2009-07-023-D semiconductor die structure with containing feature and method
#7 | 2008-12-04Method for forming interconnects for 3-D applications
#8 | 2008-12-04Method to form a via
#9 | 2008-05-15METHOD OF FORMING A THROUGH-SUBSTRATE VIA
#10 | 2008-05-01Micropad for bonding and a method therefor
#11 | 2007-07-26Semiconductor interconnect having adjacent reservoir for bonding and method for formation
#12 | 2007-07-12Dual plasma treatment barrier film to reduce low-k damage
#13 | 2006-09-14Method of forming a semiconductor device having a diffusion barrier stack and structure thereof
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