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Inventor profile of:

John Boyd

City:

Atascadero, California

Country:

United States

Published Applications:

Last publication date:

2011-06-30

Top Assignees for applications by John Boyd

The entities that hold a legal rights for patent applications filed by inventor Boyd John:

LAM RESEARCH CORPORATION 18 Fremont, CA United States
Lam Research Corp. 3 Fremont, CA United States
Advanced Materials Sciences, Inc. 1 Portland, OR United States

Recent patent applications by Boyd John

John Boyd from Atascadero, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2011-06-30

US20110155563A1

Chemistry; metallurgy

APPARATUS AND METHOD FOR DEPOSITING AND PLANARIZING THIN FILMS OF SEMICONDUCTOR WAFERS

#2 | 2011-04-07

US20110081779A1

Chemistry; metallurgy

Method and apparatus for material deposition

#3 | 2010-07-08

US20100170803A1

Chemistry; metallurgy

Method and apparatus for plating semiconductor wafers

#4 | 2009-10-01

US20090242413A1

Chemistry; metallurgy

Electroplating head and method for operating the same

#5 | 2008-07-17

US20080171292A1

Physics

Methods for providing a confined liquid for immersion lithography

#6 | 2008-07-10

US20080166885A1

Electricity

Method and apparatus for semiconductor wafer planarization

#7 | 2008-06-26

US20080153291A1

Chemistry; metallurgy

Method for electroless depositing a material on a surface of a wafer

#8 | 2008-05-06

US10834548

Apparatus and method for providing a confined liquid for immersion lithography

#9 | 2006-12-26

US10607611

Apparatus and method for depositing and planarizing thin films of semiconductor wafers

#10 | 2006-11-23

US20060260932A1

Chemistry; metallurgy

Apparatus and method for depositing and planarizing thin films of semiconductor wafers

#11 | 2006-03-23

US20060063470A1

Performing operations; transporting

Semiconductor wafer material removal apparatus and method for operating the same

#12 | 2006-02-07

US10360322

Megasonic cleaning efficiency using auto-tuning of an RF generator at constant maximum efficiency

#13 | 2006-01-12

US20060008650A1

Performing operations; transporting

Protecting thin semiconductor wafers during back-grinding in high-volume production

#14 | 2006-01-05

US20060000487A1

Electricity

Megasonic cleaning efficiency using auto-tuning of a RF generator at constant maximum efficiency

#15 | 2005-12-29

US20050284767A1

Chemistry; metallurgy

Method and apparatus for plating semiconductor wafers

#16 | 2005-12-29

US20050284748A1

Chemistry; metallurgy

Electroplating head and method for operating the same

#17 | 2005-07-05

US10874415

Methods using active retainer rings for improving edge performance in CMP applications

#18 | 2005-06-16

US20050130415A1

Chemistry; metallurgy

Method and apparatus for material deposition in semiconductor fabrication

#19 | 2005-06-16

US20050126932A1

Electricity

Method and apparatus for semiconductor wafer planarization

#20 | 2005-03-08

US10402600

Method and apparatus to form a planarized Cu interconnect layer using electroless membrane deposition

#21 | 2005-02-24

US20050042861A1

Electricity

Method and apparatus to form a planarized Cu interconnect layer using electroless membrane deposition

InventorID:

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